TOP series top large lead-free computer hot air reflow soldering machine
Category:Reflow soldering series
Profile:Features:
• Imported heating parts, uniform temperature, high thermal compensation efficiency, suitable for welding CSP and BGA components;
• Special wind wheel design, large air exchange and stable wind speed;
• Each temperature zone adopts forced independent circulation, independent PID control, and independent heating method to make the furnace cavity temperature accurate and uniform, and the heat capacity is large:
• Warm up quickly, from room temperature to working temperature ≦ 30 minutes;
• Imported high-quality high-temperature motor with smooth operation, low vibration and low noise;
• The furnace body adopts double cylinder (electric push rod) jacking device, which is safe and reliable;
• Chain and mesh belt synchronous speed transportation, using frequency conversion precision and high speed;
• Special high-quality aluminum alloy rail design, small deformation, automatic chain refueling device;
• UPS power-off protection function ensures that the PCB board outputs normally after power-off, and is not damaged;
• Powerful software function to monitor and measure the temperature of the PCB board online, and analyze, store and print the data curve at any time;
• Industrial control PC and PLC communication adopt MODBUS protocol, work stably, prevent the phenomenon of crash;
Contact Number:400-0755-098
Immediate procurementOnline consultation